| Market | Memory | Logic | ||||
|---|---|---|---|---|---|---|
| Application | NAND Flash | DRAM | SoC (AP) | CIS | DDI, MCU, Smart Card | DC Parametric |
| Technology | MEMS | MEMS | MEMS Vertical | MEMS CIS | Cantilever-Needle | Cantilever, MEMS |
| Product Model | Cygnus | Orion | Taurus | Sirius | - | - |
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| Features |
High parallelism Full wafer contact One or two touch down |
Fine pitch for Micro bump Hybrid MEMS Probe Array Long Life Span |
High frequency, High speed Minimal Pad damage |
Design Flexibility Fast delivery |
Low leakage DC Test |
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