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產品介紹

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  • Cantilever

Cantilever Probe Card

顯示驅動晶片（DDI）的技術發展趨勢，涵蓋高效能、低功耗、多通道化及功能整合等面向。

KI 自投入 DDI 領域以來，持續隨著技術演進精進研發，在滿足現有應用需求的同時，也積極布局下一代 DDI 技術。

Application
DDI, SoC, Smart IC, CIS, ASIC
Features
Pitch : Fine pitch & Multi-DUT testing
Min. Pitch : DDI ( 12.5/25μm, 23μm) SoC (50μm)
Min. Pad Size : DDI (13X30μm) SoC (40X40μm)
Test Temp : -25℃ ~ 125℃
Test Frequency : < 6.5Gbpse
Delivery
TAT : 5 Weeks (5,000~6000 Pin) Depend on Pin Count
Inquiry

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