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产品介绍

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  • Cantilever

Cantilever Probe Card

显示驱动芯片（DDI）的演进方向包括高性能、低功耗、多通道化以及功能融合。

KI 自 DDI 起步至今一路伴随技术演进，在应对既有技术的同时，也在为下一代 DDI 的到来做准备。

Application
DDI, SoC, Smart IC, CIS, ASIC
Features
Pitch : Fine pitch & Multi-DUT testing
Min. Pitch : DDI ( 12.5/25μm, 23μm) SoC (50μm)
Min. Pad Size : DDI (13X30μm) SoC (40X40μm)
Test Temp : -25℃ ~ 125℃
Test Frequency : < 6.5Gbpse
Delivery
TAT : 5 Weeks (5,000~6000 Pin) Depend on Pin Count
Inquiry

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